PDF file is about the PCB board footprint information for SOT751-2, which contains multiple data, including dimensions, solder pads, solder paste, solder resist, etc.
This document provides the PCB footprint information required for reflow soldering of the Philips SOT751-2 LFBGA80 package. It includes the generic footprint pattern, solder land dimensions, and recommended solder paste deposit.
The layout dimensions are given in millimetres, with pad pitch, solder land width, and overall chip size specified. Users should refer to the package outline drawing for the exact layout before designing the PCB.
| Pad pitch (P) | 0.50 mm |
|---|---|
| Solder land width (SL) | 0.275 mm |
| Solder paste width (SP) | 0.300 mm |
| Solder resist width (SR) | 0.425 mm |
| Chip height (Hx) | 7.500 mm |
| Chip width (Hy) | 7.500 mm |
The footprint is for the LFBGA80 package SOT751-2.
The footprint dimensions are P = 0.50 mm, SL = 0.275 mm, SP = 0.300 mm, SR = 0.425 mm, Hx = 7.500 mm, Hy = 7.500 mm.