This is a PDF file about the SOT778-1 component, which mainly introduces the layout information of the component on the PCB.
This document provides the printed‑circuit‑board (PC‑board) footprint data for the Philips SOT778-1 HVQFN48 package. It includes the generic footprint pattern, dimensions, and recommended solder paste and land specifications for reflow soldering.
The data are presented in a table of dimensions (mm) for pads, solder lands, and reference points, and reference is made to the package outline drawing for the exact layout.
The document provides a generic footprint pattern and refers to the package outline drawing for the actual layout.