This page provides PCB footprint information for Philips SOT317-1 device.
This document provides the printed‑circuit‑board (PCB) footprint for the Philips SOT317-1 QFP100 semiconductor package. It includes the generic footprint pattern and the dimensions required for reflow soldering.
The table lists key dimensions such as pin pitch, pad size and overall package outline in millimetres, and references the package outline drawing for the exact layout.
| Pin pitch (Pi) | 0.650 mm |
|---|---|
| Pad length (Ax) | 0.700 mm |
| Package length (Cx) | 25.300 mm |
The copyright date is 2004.
The document is dated 21 December 2004.