Philips SOT349-2 PC Board Footprint Datasheet

About this manual

This document provides the printed‑circuit‑board (PCB) footprint details for the Philips SOT349-2 QFP120 package, intended for reflow soldering processes. It lists pad dimensions, spacing, and overall layout guidelines.

A generic footprint pattern is shown, and users are directed to refer to the package outline drawing for the exact layout. All dimensions are given in millimetres.

What's inside

• Footprint Information
• Generic Footprint Pattern
• Dimensions
• Package Outline Reference

Frequently asked questions

What package does this footprint apply to?

It applies to the Philips SOT349-2 QFP120 package.

When was this footprint manual published?

The document was published on 21 December 2004.

Who holds the copyright for this document?

© Koninklijke Philips Electronics N.V. holds the copyright.