This document provides information about PC board dimensions for Philips Semiconductors, including the occupied area of SOT646-1 solder land and the generic footprint pattern.
This document supplies the PCB footprint information required for reflow soldering of the Philips SOT646-1 (TSSOP64) semiconductor package. It includes a generic footprint pattern and references the package outline drawing for the exact layout.
Key dimensions such as pad spacing, pad size, and overall footprint measurements are listed in millimetres, enabling designers to create accurate board layouts for this component.
A generic footprint pattern is provided; designers should refer to the package outline drawing for the actual layout.
Key dimensions include P1 = 0.500 mm, P2 = 0.560 mm, Ay = 8.900 mm, By = 6.100 mm, C = 1.400 mm, D1 = 0.280 mm, D2 = 0.400 mm, Gx = 16.270 mm, Gy = 7.000 mm, Hx = 17.900 mm, Hy = 9.150 mm.