This document is a printed circuit board printing guide that provides detailed information about the printing size and solder location of SOT754-1.
This document supplies the PCB footprint information for the Philips SOT754-1 package, which uses a TFBGA256 ball grid array. It includes details on solder land, solder paste deposit, and occupied area needed for reflow soldering.
The footprint dimensions are given in millimetres (P, SL, sP, SR, Hx, Hy) and reference is made to the package outline drawing for the actual layout. The manual was published on 15 September 2004.
It corresponds to a TFBGA256 package.
The manual was published on 15 September 2004.