This document provides information about the PCB board soldering dimensions for the SOT307-2 package from Philips Electronics. It includes the occupied area, dimensions, and solder land information for the QFP44 package suitable for reflow soldering.
This document provides the printed‑circuit‑board (PCB) footprint dimensions required for reflow soldering of the Philips SOT307-2 component, which is supplied in a QFP44 package.
A generic footprint pattern is shown, and users are directed to the package outline drawing for the exact layout details. Dimensions are given in millimetres for pads, solder lands, and overall occupied area.
| Package type | QFP44 |
|---|---|
| Footprint pattern | Generic |
The SOT307-2 is supplied in a QFP44 package.
Refer to the package outline drawing for the actual layout dimensions.