This document introduces the design support information for Rohm UCSP75M2 (BD6373GW)
This design support document describes the UCSP75M2 semiconductor package, including its structure, materials, and marking information. It details tape‑and‑reel packaging, packing style, and shipping specifications.
The document also outlines recommended storage conditions, soldering temperature profiles, and handling precautions, helping designers integrate the component safely into their products.
| Die material | Silicon |
|---|---|
| Cu Post material | Cu |
| Encapsulation (first layer) | Epoxy Resin |
| External terminal solder | Sn‑3Ag‑0.5Cu |
| Encapsulation (second layer) | Polyamide‑imide Resin |
| Tape type | Embossed carrier tape |
| Cover tape material | PET + PE |
| Recommended storage temperature | 5~30 °C |
| Recommended storage humidity | 40~70 % RH |
| Specified storage period | 1 year |
| Maximum reflow peak temperature | 260 °C |
| Preheating temperature range | 130~190 °C |
| Soldering temperature range | 220~230 °C |
| Quantity per reel | 3,000 pcs |
Each reel contains 3,000 pieces of the UCSP75M2 package.