This document is a design support document for ROHM UCSP35L1 (BU52055GWZ)
This ROHM design support document provides detailed information on the UCSP35L1 semiconductor package, including its structure, materials, and recommended handling. It covers packaging specifications such as tape and reel dimensions, storage conditions, marking lot numbers, and soldering profiles.
The document also lists footprint and external dimensions, as well as precautions for handling and underfill material usage. It is intended for engineers designing with the UCSP35L1 component and includes typical application guidance.
| Package | UCSP35L1 |
|---|---|
| Die Material | Silicon |
| External Terminal Material | Sn-3Ag-0.5Cu Solder |
| Mold Compound | Polyamide-imide Resin |
| Storage Temperature | 5 to 30°C |
| Storage Humidity | 40 to 70% RH |
| Specified Storage Period | 1 year |
| Reflow Peak Temperature | 260°C MAX |
| Preheating Temperature | 130°C to 190°C |
| Soldering Temperature | 220°C to 230°C |
| Cover Tape Peelback Strength | 0.2 to 0.7N |
| Pieces per Reel | 3,000 pcs |
The recommended storage temperature is 5 to 30°C.
The reflow peak temperature should not exceed 260°C.
Each reel holds 3,000 pieces of the UCSP35L1 package.
The cover tape peelback strength is specified as 0.2 to 0.7 N.