This document is a data sheet for TSSOP-B packaging dimensions from ROHM. It provides detailed information on TSSOP-B8J, TSSOP-B8 and TSSOP-B14J packaging dimensions, including pin pitch, package length, width and height.
This design support document describes the structure and materials of the TSSOP‑B semiconductor package, including lead frame composition, die material, die‑attach, wire and molding details. It also covers tape‑and‑reel packaging, labeling, packing style, and shipping specifications.
Additional sections give recommended storage conditions, marking lot numbers, footprint dimensions, and recommended soldering profiles for reflow, wave, and hand soldering. The document ends with legal notices and contact information for ROHM.
| Die material | Silicon |
|---|---|
| Die attach material | Ag Paste |
| Wire material | Au |
| Molding material | Epoxy Resin |
| Recommended storage temperature | 15 to 30 °C |
| Recommended storage humidity | 40 to 70 % RH |
| Maximum reflow peak temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
Store the packages at 15 °C to 30 °C with 40 % to 70 % relative humidity for up to one year.
The reflow peak temperature should not exceed 260 °C.
The tape width is 5.4 mm and the tape height is 3.3 mm.
Use a solder‑iron temperature of 380 °C or less, with a mounting time of 4 seconds or less.