This is a pdf file published by rohm, which introduces the package dimensions of rohm's products
This design support document describes the structure, materials, and packaging details for the ROHM SOP8G semiconductor package. It includes information on tape and reel dimensions, packing style, shipping style, and labeling requirements.
The document also lists technical specifications such as footprint dimensions, recommended storage conditions, and soldering profiles for both reflow and wave soldering. Additional guidance covers missing IC tolerances, peel‑back strength, and safety notices for product use.
| Package dimensions (SOP8G) | 5.0 ± 0.2 mm (max 5.35 mm) |
|---|---|
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Recommended storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Wave soldering preheating temperature | 120 °C to 150 °C |
| Wave soldering soldering temperature | 260 °C + 3 °C |
| Solder iron temperature | ≤ 380 °C |
The SOP8G tape dimensions are 6.8 mm width, 55 mm length, 41.5 mm height, with a pitch of 1.5 mm and a spacing of 1.75 mm.
Use a preheating temperature of 120 °C‑150 °C for up to 60 seconds, then a soldering temperature of 260 °C + 3 °C for up to 12 seconds.