SOT747-1_fp is a electronic component manufactured by Philips Semiconductors. The product model is SOT747-1, which is the footprint information for reflow soldering of TFBGA72 package.
This manual gives the footprint information required for reflow soldering of the TFBGA72 package SOT747-1. It includes generic pattern details, solder land definitions, and recommended solder paste deposit.
The document lists the exact PCB dimensions in millimetres and refers users to the package outline drawing for the complete layout.
| P | 0.50 mm |
|---|---|
| SL | 0.275 mm |
| sP | 0.300 mm |
| SR | 0.425 mm |
| Hx | 7.500 mm |
| Hy | 7.500 mm |
It covers the TFBGA72 package SOT747-1.
The dimensions are P = 0.50 mm, SL = 0.275 mm, sP = 0.300 mm, SR = 0.425 mm, Hx = 7.500 mm, Hy = 7.500 mm.
Refer to the package outline drawing for the actual layout.