This document provides information on the PCB footprint and soldering dimensions of the SOT420-1 semiconductor device from Philips Electronics.
This manual supplies the PCB footprint pattern for the Philips SOT420-1 (LQFP128) semiconductor package, intended for use in reflow soldering processes. It includes the generic footprint layout and references the package outline drawing for the exact pad arrangement.
Key dimensions such as pad pitch, pad size, and overall package outline are listed in millimetres, enabling designers to create accurate board layouts that meet Philips' specifications.
| Pad pitch (X direction) | 0.400 mm |
|---|---|
| Pad pitch (Y direction) | 0.430 mm |
| Package outline width | 17.300 mm |
| Package outline height | 17.300 mm |
| Pad length | 1.500 mm |
It corresponds to the LQFP128 package.
The manual was published on 29 December 2004.