This file details the dimensions, pads, etc. of SOT360-1
This document provides the PCB footprint information required for reflow soldering of the Philips SOT360-1 TSSOP20 package. It includes the generic footprint pattern and the dimensions of each land and overall outline.
The dimensions are given in millimetres for pin pitch, land size, and overall package height and width. For the exact package outline, refer to the separate package outline drawing referenced in the document.
The footprint is for the Philips SOT360-1 TSSOP20 package.
Refer to the package outline drawing mentioned in the document for the actual layout.