Philips SOT687-1 PCB Footprint (Reflow Soldering)

About this manual

This one‑page document shows the PCB footprint for the Philips SOT687-1 semiconductor package, intended for use with reflow soldering processes. It includes the layout of solder lands, clearance values and occupied area.

All dimensions are expressed in millimetres, and the drawing lists the copper thickness and spacing required for proper assembly. The footprint can be used directly in PCB CAD tools to ensure correct pad placement. This manual is written in Japanese.

What's inside

• Footprint Overview
• Solder Land Dimensions
• Clearance Requirements
• Occupied Area
• Dimensions in mm

Specifications

Frequently asked questions

What footprint is provided for the Philips SOT687-1?

The document provides the SOT687-1 footprint for reflow soldering.

In what units are the footprint dimensions given?

Dimensions are expressed in millimetres.