This document introduces the PS21564-SP Dual-In-Line Package Intelligent Power Module from MITSUBISHI SEMICONDUCTOR, which is a 600V/15A low-loss 5th generation IGBT inverter bridge for three-phase DC-to-AC power conversion. It is designed for small power motor control in AC100V~200V inverters.
The PS21564-SP is a dual‑in‑line package (DIP) intelligent power module that integrates drive, protection, and system‑control functions for three‑phase DC‑to‑AC conversion. It features a 600 V, 15 A low‑loss IGBT inverter bridge with open‑emitter type architecture, suitable for small‑power motor drives operating from 100 V to 200 V AC.
The document lists maximum ratings, electrical and thermal characteristics, mechanical dimensions, recommended mounting torque, and wiring guidelines. It also includes timing charts for short‑circuit and under‑voltage protection, as well as typical application circuits and CPU I/O interface recommendations.
| Supply voltage (Veco) | 450 V |
|---|---|
| Collector‑emitter voltage (VCES) | 600 V |
| Continuous collector current | 15 A |
| Weight | 20 g |
| Isolation voltage (Viso) | 2500 V |
The module can handle a continuous collector current of 15 A per IGBT.
All connected pins to the heat‑sink plate must withstand an isolation voltage of 2500 V.