This design support document introduces the features and characteristics of VCSP50L1 (BH6456GUL), including application circuit, circuit constants, interface definition and pin configuration.
This design support document describes the VCSP50L1 semiconductor package, covering its structure, materials, and detailed mechanical dimensions. It includes tape‑and‑reel packing specifications, storage conditions, marking information, and recommended soldering profiles.
Key sections cover footprint and external dimensions, peel‑back strength, handling cautions, and under‑fill recommendations, helping designers integrate the package reliably into their products.
| Dehydrated weight | 0.002 g |
|---|---|
| Cover tape peelback strength | 0.2 to 0.7 N |
| Peelback speed | 165 to 180 mm/min |
| Recommended storage temperature | 5 °C to 30 °C |
| Recommended storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Maximum reflow temperature | 260 °C |
| Preheating temperature range | 130 °C to 190 °C |
| Soldering temperature range | 220 °C to 230 °C |
The cover tape peelback strength is specified as 0.2 to 0.7 N.