This document is about Xilinx Spartan™-3 FPGA data sheet, including 4 modules: Introduction and Ordering Information, Functional Description, DC and Switching Characteristics, Pinout Descriptions, which detail the features, functions, structure, pin definitions of Spartan™-3 FPGA
The Spartan‑3 family of Field‑Programmable Gate Arrays is designed for high‑volume, cost‑sensitive consumer electronic applications. It offers densities from 50 000 to 5 million system gates, three power rails, extensive I/O options and advanced clock management.
The document is divided into four modules: Introduction and Ordering Information, Functional Description, DC and Switching Characteristics, and Pinout Descriptions. It includes architectural overviews, configuration modes, I/O standards, package options (including Pb‑free versions) and a complete revision history.
| Maximum logic cells | 74,880 |
|---|---|
| Power rails | Core 1.2 V, I/Os 1.2 V‑3.3 V, Auxiliary 2.5 V |
| Maximum I/O pins | 784 |
| Block RAM capacity | 1,872 Kbits |
| Distributed RAM capacity | 520 Kbits |
| Dedicated multipliers | 18 × 18 |
| Digital Clock Managers | Up to four DCMs |
Spartan‑3 devices support Master Parallel, Slave Parallel, Master Serial, Slave Serial, and Boundary Scan (JTAG) configuration modes.
The family supports 18 single‑ended standards (e.g., LVCMOS, LVTTL, PCI) and 6 differential standards (e.g., LVDS, RSDS).
Both standard and Pb‑free packaging options are available; Pb‑free packages include a ‘G’ character in the ordering code.
Commercial‑grade devices operate from 0 °C to 85 °C.