Micron DDR333 SDRAM 256Mb x4/x8/x16 Datasheet Addendum

256Mb: x4, x8, x16 DDR333 SDRAM technical specifications


Micron DDR333 SDRAM 256Mb x4/x8/x16 Datasheet Addendum - cover page
Brand
Micron
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
8
File format
PDF
File size
172 KB
Published
28 March, 2012
Updated
30 September, 2023
Model
X16
MD5 checksum
15692C835936005F714EB1125F4B3CF9

About this manual

The DDR333 SDRAM is a high‑speed CMOS dynamic RAM operating at 167 MHz with a peak data rate of 333 Mb/s per pin. It is offered in 256 Mb densities with data‑width options of x4, x8, and x16, and is backward compatible with DDR200 and DDR266 designs.

The addendum details the two package options—66‑pin TSOP and 60‑ball FBGA—along with full pin‑out tables, timing parameters, capacitance values, and recommended operating conditions for designers integrating these parts into memory subsystems.

What's inside

  • Features
  • Options
  • Configuration
  • Package Dimensions
  • Pin Descriptions
  • General Description
  • Electrical Characteristics
  • Capacitance
  • Timing Parameters

Specifications

Clock frequency167 MHz
Data rate333 Mb/s per pin
Core voltage+2.5 V ±0.2 V
Package types66‑pin TSOP, 60‑ball FBGA
Package types (cont.)60‑ball FBGA (16 × 9 mm)
Cycle time (CL = 2.5)6 ns
Average refresh interval7.8 µs

Frequently asked questions

What data‑width options are available for the DDR333 SDRAM?

The device is offered in 256 Mb densities with x4, x8, and x16 data‑width configurations.

Which package styles does the DDR333 SDRAM support?

It is available in a 66‑pin TSOP package and a 60‑ball FBGA package.

What is the operating clock frequency of the DDR333 SDRAM?

The part operates at a 167 MHz clock frequency, providing a 333 Mb/s per pin data rate.

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