Philips SOT662-1 PC Board Footprint Manual

About this manual

This document provides the printed‑circuit‑board (PCB) footprint data required for reflow soldering of the HVQFN20 package identified as SOT662-1. It includes the generic footprint pattern and the recommended dimensions for pads, solder paste, and occupied area.

The table lists key dimensions in millimetres, such as pad pitch, pad length, and pad width, together with the total solder land and paste areas. Designers should refer to the package outline drawing for the exact layout before applying these values.

What's inside

• Footprint Overview
• Generic Footprint Pattern
• Dimensions in mm

Frequently asked questions

What package does this footprint apply to?

It applies to the HVQFN20 package SOT662-1.

When was this footprint manual published?

The manual was published on 13 October 2004.

Who holds the copyright for this document?

© Koninklijke Philips Electronics N.V. 2004.