This is a PDF file of SOT320-2_fp_reflow, which provides detailed information on the PCB printed circuit board of SOT320-2, including dimensions, welding positions, etc.
This document supplies the footprint information required for reflow soldering of the QFP128 package identified as SOT320-2. It lists pad dimensions, spacing, and occupied area to aid PCB designers.
The generic footprint pattern is shown, and users are directed to the package outline drawing for the exact layout. All dimensions are given in millimetres.
It corresponds to the QFP128 package.
Refer to the package outline drawing for the actual layout.
Key dimensions include a pad pitch of 0.800 mm, pad width of 0.800 mm, pad length of 0.850 mm, and pad spacing of 31.900 mm.