This document provides the PCB footprint information of SOT788-1.
This document supplies the PCB footprint information required for reflow soldering of the Philips SOT788-1 HVQFN28 package. It includes the generic footprint pattern and references the package outline drawing for the actual layout.
A table of dimensions in millimetres lists pad sizes, solder land areas, and overall footprint measurements such as SLx, SLy, SPx, SPy, Gx, Gy, Hx, and Hy.
Yes, it provides footprint information specifically for reflow soldering of the HVQFN28 SOT788-1 package.