This document provides the PCB footprint information for SOT962-3, including dimensions, solder pads position etc.
This document supplies the PCB footprint information required for reflow soldering of the NXP SOT962-3 (TFBGAG4) package. It includes a generic footprint pattern and references to the package outline drawing for the actual layout.
The dimensions are given in millimetres for pad size, solder paste area, and overall occupied area, enabling accurate board design and manufacturing.
| Pad length (P) | 0.50 mm |
|---|---|
| Pad width (SL) | 0.275 mm |
| Solder paste length (sP) | 0.300 mm |
| Solder paste width (SR) | 0.425 mm |
| Footprint height (Hx) | 4.900 mm |
| Footprint width (Hy) | 4.900 mm |
The SOT962-3 uses a generic footprint pattern as shown in the document, with specific pad and solder paste dimensions.
The footprint dimensions are 0.50 mm (P), 0.275 mm (SL), 0.300 mm (sP), 0.425 mm (SR), and 4.900 mm for both height (Hx) and width (Hy).