SOT1078-1_fr is a PDF file published by NXP B.V. 2008, which contains the PCB layout information of SOT1078-1
This document describes the PCB footprint for the NXP SOT1078-1 component, which uses a VFBGA144 package. It includes information needed for reflow soldering, such as solder land sizes and paste deposit guidelines.
The footprint pattern, generic layout, and exact dimensions in millimetres are listed, and users are directed to the package outline drawing for the final layout details.
| P (pad width) | 0.40 mm |
|---|---|
| SL (solder land width) | 0.250 mm |
| SR (solder land length) | 0.275 mm |
| Hx (footprint height X) | 0.350 mm |
| Hy (footprint height Y) | 5.900 mm |
It corresponds to the VFBGA144 package.
Refer to the package outline drawing for the actual layout.