This is a SOT913-1 PCB footprint drawing.
This document supplies the recommended PCB footprint for the NXP SOT913-1 device, which uses an LFBGA340 package. It includes pad layout, solder land markings, and reflow soldering instructions.
The footprint dimensions are listed in millimetres, with specific values for pad length, width, spacing, and overall occupied area. Refer to the package outline drawing for the exact layout before designing the board.
| Pad length (SL) | 0.50 mm |
|---|---|
| Pad width (SP) | 0.275 mm |
| Pad spacing (SR) | 0.300 mm |
| Pad height (Hx) | 0.425 mm |
| Occupied area (X dimension) | 12.400 mm |
| Occupied area (Y dimension) | 12.400 mm |
The SOT913-1 uses the LFBGA340 package.
The footprint dimensions are 0.50 mm (pad length), 0.275 mm (pad width), 0.300 mm (pad spacing), 0.425 mm (pad height), with an occupied area of 12.400 mm × 12.400 mm.