The document provides information about the PCB board dimensions for NXP Semiconductors. It includes the dimensions of the solder land and solder paste area for the LFBGA516 package, as well as a generic footprint pattern for reflow soldering.
This document provides the PCB footprint information required for reflow soldering of the NXP SOT965-1 LFBGA516 package. It includes a generic footprint pattern with solder land and paste areas and references the package outline drawing for the actual layout.
The dimensions are given in millimetres: pad width, solder land width, solder paste width, solder resist width, and overall X/Y extents. These values are intended for use in PCB design and manufacturing.
| Pad width (P) | 0.50 mm |
|---|---|
| Solder land width (SL) | 0.275 mm |
| Solder paste width (sP) | 0.300 mm |
| Solder resist width (SR) | 0.425 mm |
| Footprint X dimension (Hx) | 14.400 mm |
| Footprint Y dimension (Hy) | 14.400 mm |
The manual shows a generic footprint pattern with solder land (YY) and solder paste (N) areas, plus the occupied area and solder resist markings.
The dimensions are P=0.50 mm, SL=0.275 mm, sP=0.300 mm, SR=0.425 mm, Hx=14.400 mm, Hy=14.400 mm.