This document is the description document of NXP Semiconductors PC board footprint Footprint for reflow soldering of HVSON14 package SOT1054-1.
This document defines the PCB footprint for reflow soldering of the NXP SOT1054-1 HVSON14 package. It includes the pad layout, dimensions, and recommended solder‑paste parameters.
The footprint data are given in millimetres and are intended for use in PCB design tools. The file also notes the copyright information and the date of publication.
| Pad length | 4.200 mm |
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It applies to the HVSON14 package.
The document is copyrighted in 2008.