NXP SOT728-2 PC Board Footprint Manual

About this manual

This document supplies the PCB footprint information required for reflow soldering of the LBGA324 package identified as SOT728-2. It includes the layout of solder lands, paste deposits, and the occupied area on the board.

Key dimensions such as Hx, Hy and other layout measurements are listed in millimetres, and users are directed to the package outline drawing for the complete layout details.

What's inside

• PC board footprint
• Footprint information for reflow soldering
• Dimensions in mm
• Solder land and paste deposit
• Reference to package outline drawing

Frequently asked questions

What package does the SOT728-2 footprint correspond to?

It corresponds to the LBGA324 package.

Where can I find the complete layout dimensions for the footprint?

Refer to the package outline drawing for the actual layout.