This document provides information about the PC board footprint dimensions of the SOT1088-1 package from NXP B.V. 2008. It includes details about solder land dimensions, solder paste occupied area, etc.
This document describes the recommended PCB footprint for the NXP SOT1088-1 HBGA520 package, including solder land and paste deposit information for reflow soldering.
It lists the generic footprint pattern, key dimensions in millimetres, and refers to the package outline drawing for the actual layout details.
| Pad length (SL) | 1.00 mm |
|---|---|
| Pad width (SP) | 0.450 mm |
| Solder resist width (SR) | 0.450 mm |
| Pad height (Hx) | 0.600 mm |
| Pad spacing (Hy) | 27.500 mm |
It applies to the HBGA520 package SOT1088-1.
Refer to the package outline drawing for the actual layout.