NXP SOT1063-1 PC Board Footprint Manual

About this manual

This document supplies the PCB footprint information required for reflow soldering of the NXP SOT1063-1 component, which uses a VFBGA48 package. It lists the solder land sizes, paste deposit guidelines, and occupied area definitions.

The layout dimensions are given in millimetres, with pad pitches of 4.400 mm in both X and Y directions. For the exact outline, refer to the package outline drawing referenced in the manual.

What's inside

• PC board footprint
• Footprint information
• Dimensions
• Generic footprint pattern

Frequently asked questions

What package does the SOT1063-1 use?

It uses a VFBGA48 package.

Where can I find the actual layout drawing?

Refer to the package outline drawing for the actual layout.

When was this footprint manual published?

The document is dated 29 April 2008.