This document provides information about the PC board footprint dimensions of the NXP SOT1085-1 package. It describes the dimensions of the solder land and solder paste deposit, as well as the generic footprint pattern for reflow soldering.
The document supplies the PCB footprint information required for reflow soldering of the LFBGA273 package identified as OT1085-1. It includes generic pattern guidance and references to the package outline drawing for the actual layout.
Key dimensions are listed in millimetres, specifying pad width, solder land width, solder paste deposit, and overall footprint size. The data helps designers create accurate board layouts that meet NXP's specifications.
| Pad width (P) | 0.50 mm |
|---|---|
| Solder land width (SL) | 0.275 mm |
| Solder paste deposit (sP) | 0.300 mm |
| Solder resist width (SR) | 0.425 mm |
| Footprint height (Hx) | 10.400 mm |
| Footprint width (Hy) | 10.400 mm |
The OT1085-1 footprint is for the LFBGA273 package.
The footprint dimensions are P=0.50 mm, SL=0.275 mm, sP=0.300 mm, SR=0.425 mm, Hx=10.400 mm, Hy=10.400 mm.