This document provides PC board footprint dimensions for NXP B.V. 2008. It includes solder land and solder paste dimensions for the LFBGA296 package, as well as a generic footprint pattern for reflow soldering. The document provides important information on product dimensions and soldering methods for users.
This document supplies the PCB footprint data required for reflow soldering of the LFBGA296 package identified as SOT1107-1. It includes the layout pattern, solder land dimensions, and recommended solder paste deposits.
The dimensions are given in millimetres, and users are directed to the package outline drawing for the exact layout. The generic footprint pattern file is named SOT1107-1_fr.
It corresponds to the LFBGA296 package.
Refer to the package outline drawing for the actual layout.