This is a PCB footprint for SOT486-1, which details the dimensions, occupied area, etc. of the footprint.
This document defines the PCB footprint for the Philips SOT486-1 LQFP144 package, intended for reflow soldering processes. It includes a generic footprint pattern and references the package outline drawing for the exact layout.
Key dimensions such as pin pitch, pad width, and pad length are listed in millimetres, allowing designers to create compliant board layouts.
| Pin pitch | 0.500 mm |
|---|---|
| Pad width | 0.560 mm |
| Pad length | 23.300 mm |
| Pad spacing (X) | 20.300 mm |
| Pad spacing (Y) | 20.300 mm |
The document provides a generic footprint pattern that should be used, with reference to the package outline drawing for the actual layout.