This is a technical manual about SOT542-1. It contains information about the size, soldering pad, solder paste of SOT542-1
This document provides the PCB footprint information required for reflow soldering of the Philips SOT542-1 (TFBGA56) package. It includes a generic footprint pattern and references to the package outline drawing for the actual layout.
Key dimensions are listed in millimetres, along with recommended solder land and paste deposit areas. The data helps designers create correct pad sizes and solder resist areas for reliable assembly.
| Pad width (P) | 0.50 mm |
|---|---|
| Solder land width (SL) | 0.275 mm |
| Solder paste width (sP) | 0.300 mm |
| Solder resist width (SR) | 0.425 mm |
| Footprint height X (Hx) | 6.500 mm |
| Footprint height Y (Hy) | 6.500 mm |
The document provides a generic footprint pattern and advises to refer to the package outline drawing for the actual layout.
The dimensions are P=0.50 mm, SL=0.275 mm, sP=0.300 mm, SR=0.425 mm, Hx=6.500 mm, Hy=6.500 mm.