MiniMOS devices are an advanced series of power MOSFETs which utilize Motorola’s High Cell Density HDTMOS process. These miniature surface mount MOSFETs feature ultra low RDS(on) and true logic level performance. They are capable of withstanding high energy in the avalanche and commutation modes and the drain–to–source diode has a very low reverse recovery time. MiniMOS devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc–dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. The avalanche energy is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients.
This document is a Designer's Data Sheet for the Motorola MMSF3P02HD, a single P-Channel Field Effect Transistor (FET) from the MiniMOS series. The device utilizes Motorola's High Cell Density HDTMOS process and is designed for low voltage, high speed switching applications where power efficiency is critical. It is intended for use in DC-DC converters, power management in portable products, and low voltage motor controls.
The datasheet provides maximum ratings, electrical characteristics, and typical performance curves. Key specifications include a drain-to-source voltage of 20V, a continuous drain current of 5.6A at 25°C, and an ultra-low on-resistance (RDS(on)) of 0.075 ohms. The document also details switching characteristics, gate charge, and source-drain diode properties, along with mounting information for the SO-8 surface mount package.
| Drain-to-Source Voltage | 20 Vdc |
|---|---|
| Drain Current — Continuous @ Ta = 25°C | 5.6 Adc |
| Operating and Storage Temperature Range | - 55 to 150 °C |
| Turn-On Delay Time | 25 ns |
| Package Type | SO-8 Surface Mount |
Typical applications include DC-DC converters, power management in portable and battery powered products, and low voltage motor controls.
Yes, the device features true logic level performance and can be driven by logic ICs.
The maximum lead temperature for soldering purposes is 260 °C for 1/8” from the case for 10 seconds.