Update: 01 October, 2023
IRF1310NS/L HEXFET® is an extremely efficient and reliable power device from International Rectifier company, which utilizes advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on- resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF1310NL) is available for low- profile applications.
File format: PDF
Size: -
MD5 Checksum: AB08F18A7C33432E1D080C9C158E7209
Publication date: 04 June, 2012
Downloads: -
PDF Link: lnternational IOR Rectifier IRF1310NS/L handbook PDF