IXYS DHG 40 C 600 HB Fast Recovery Diode Datasheet

DHG 40 C 600 HB is a fast recovery diode produced by Philips Semiconductors. It has the characteristics of very low leakage current, very short recovery time, improved thermal behavior, very low Irm values, very soft recovery behavior, rated avalanche voltage for reliable operation, soft reverse recovery for low EMI/RFI, low Irm can reduce: - power dissipation within the diode - Turn-on loss in the commutating switch


IXYS DHG 40 C 600 HB Fast Recovery Diode Datasheet - cover page
Brand
IXYS
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
3
File format
PDF
File size
102 KB
Published
10 April, 2012
Updated
30 September, 2023
MD5 checksum
D8B6627E669EC80AC3FF5A1D8CB4E093

About this manual

The DHG 40 C 600 HB is an advanced fast recovery diode with planar passivated chips, very low leakage current, short recovery time, and soft reverse recovery for low EMI/RFI. It is suitable for antiparallel, snubber, free‑wheeling, and rectifier applications in SMPS and UPS designs.

The datasheet lists electrical ratings such as a 600 V repetitive reverse voltage, 70 A RMS current per pin, and a junction‑to‑case thermal resistance of 0.90 K/W. Mechanical information includes a TO‑247 common‑cathode package, a weight of 6 g, and detailed dimensions for the housing.

What's inside

  • Features / Advantages
  • Ratings
  • Applications
  • Package Information
  • Ordering Information
  • Mechanical Dimensions

Specifications

Repetitive reverse voltage (VRRM)600 V
RMS current per pin70 A
Junction‑to‑case thermal resistance (RthJC)0.90 K/W
Package typeTO-247
Weight6 g

Frequently asked questions

What is the maximum reverse voltage rating of the DHG 40 C 600 HB diode?

The diode is rated for a repetitive reverse voltage of 600 V.

What package does the DHG 40 C 600 HB diode use?

It is supplied in a common‑cathode TO‑247 package.

What is the RMS current capability per pin?

The diode can handle up to 70 A RMS current per pin.

What is the thermal resistance from junction to case?

The junction‑to‑case thermal resistance is 0.90 K/W.

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