Samsung K4S280832B CMOS SDRAM Datasheet


Samsung K4S280832B CMOS SDRAM Datasheet - cover page
Brand
Samsung
Category
Other Electronics
Document type
Datasheet
Language
English
Pages
10
File format
PDF
File size
140 KB
Published
01 April, 2012
Updated
29 September, 2023
MD5 checksum
C020A3910DAAF57CF7F5752FC722FF04

About this manual

The K4S280832B is a 128 Mbit CMOS synchronous DRAM organized as 4 M × 8 bit with four banks. It complies with JEDEC 3.3 V standards and offers features such as auto‑refresh, programmable burst length, and selectable CAS latency.

The document lists absolute maximum ratings, recommended operating conditions (3.0‑3.6 V supply, -55 °C to +150 °C storage), pin configuration for a 54‑pin TSOP package, and detailed timing parameters for both DC and AC operation. IBIS specifications and a simplified truth table are also included.

What's inside

  • Features
  • Ordering Information
  • Functional Block Diagram
  • Pin Configuration
  • Absolute Maximum Ratings
  • DC Operating Conditions
  • DC Characteristics
  • AC Operating Test Conditions
  • IBIS Specification
  • Simplified Truth Table

Specifications

Capacity128 Mbit
Organization4 M × 8 bit × 4 banks
Supply voltage (VDD)3.0 V – 3.6 V (typ 3.3 V)
CAS latency2 or 3 clock cycles
Maximum operating frequency (CL‑3)133 MHz
Storage temperature range-55 °C – +150 °C

Frequently asked questions

What is the recommended supply voltage for the K4S280832B?

The recommended supply voltage is 3.3 V, with a range of 3.0 V to 3.6 V.

What are the CAS latency options for this SDRAM?

The device supports CAS latency of 2 or 3 clock cycles.

What is the maximum clock frequency for the CL‑3 version?

The CL‑3 version operates up to 133 MHz.

What is the function of the CLK pin?

CLK is the system clock and is active on the positive‑going edge to sample all inputs.

Download PDF (140 KB)

More Samsung Manuals


View all Samsung manuals →