This document is a specification for the package outline of NXP Semiconductors. It provides information about the dimensions, pin configuration, and characteristics of the package.
The document presents the mechanical outline of NXP's SOT1066-1 ultra‑thin quad flat package (HUQFN92U). It lists the package type, terminal arrangement and reference dimensions.
Key data include 92 terminals, a body size of 7 × 7 × 0.55 mm, and the maximum outline dimensions for the package. The outline references comply with IEC, JEDEC and JEITA standards.
| Number of terminals | 92 |
|---|---|
| Body dimensions (L × W × H) | 7 mm × 7 mm × 0.55 mm |
| Package type | HUQFN92U (plastic thermal enhanced ultra thin quad flat package) |
The SOT1066-1 package has 92 terminals.
The package measures 7 mm × 7 mm × 0.55 mm (length × width × height).
It is a HUQFN92U, a plastic thermal enhanced ultra thin quad flat package.