This is a Nxp pc board footprint file, which describes the SOT903-1 package pcb dimensions
This document supplies the printed‑circuit‑board (PCB) footprint for reflow soldering of the HLQFN64 package identified as SOT903-1. It lists the layout of solder lands, paste areas, resist patterns and the occupied area dimensions required for proper assembly.
The sheet includes a table of dimensions in millimetres, reference drawings of each pad, and copyright information indicating the file was released by NXP B.V. in 2007.
| Package type | HLQFN64 |
|---|---|
| Dimensions unit | mm |
| Solder lands | Defined layout |
| Solder paste area | Defined layout |
| Solder resist area | Defined layout |
| Occupied area | Defined layout |
The footprint is for the HLQFN64 package.
The document is dated PDF Rev. 01 — 4 June 2007.
NXP B.V. holds the copyright, as shown in the footer.