This application note describes the recommended method of applying thermal compound to MITSUBISHI RA series RoHS compliance products.
The note provides general guidance for maintaining high reliability of Mitsubishi Electric RA series silicon RF power modules by keeping the case temperature low. It recommends keeping the case temperature below 90 °C under all conditions and below 60 °C under standard conditions.
It describes the thermal‑compound application process, including the amount of compound for each package type, the alternating finger‑tight screw procedure, and the required coverage of the compound on the flange to achieve low thermal resistance.
| Maximum case temperature (standard conditions) | 60 °C |
|---|---|
| Minimum amount of compound for H46s package | 15 mm |
| Minimum amount of compound for H1i1S package | 100 mm |
| Minimum amount of compound for H2s package | 120 mm |
| Minimum amount of compound for H2M package | 70 mm |
Approximately 15 mm of thermal compound is recommended for the H46s package.