This document introduces the power consumption characteristics of USPQ-4B03, including the relationship between power consumption and ambient temperature.
The document provides reference power‑dissipation data for the USPQ‑4B03 component measured on a 40 × 40 mm (1600 mm²) FR‑4 board with four copper layers, each connected to the package heat‑sink. The board is mounted naturally with lead‑free soldering, and the ambient temperature is controlled by natural convection.
Power‑dissipation values are plotted against ambient temperature up to the maximum junction temperature of 125 °C, showing thermal resistance and corresponding dissipation in milliwatts for various temperatures.
| Board Dimensions | 40 x 40 mm (1600 mm²) |
|---|---|
| Board Structure | 4 Copper Layers |
| Material | Glass Epoxy (FR‑4) |
| Board Thickness | 1.6 mm |
| Through‑hole Diameter | 4 x 0.8 mm |
| Maximum Junction Temperature (Tj max) | 125 °C |
The maximum junction temperature is specified as 125 °C.