This one‑page datasheet provides power dissipation data for the Torex USPQ-4B03 semiconductor device. It lists the measurement conditions, board dimensions, material, copper layers and other reference details used to generate the data.
The document includes a table of ambient temperature versus power dissipation and thermal resistance, showing values from 25 °C up to 125 °C for a board mounted configuration.
| Board size (reference) | 40 x 40 mm (1600 mm²) |
|---|---|
| Copper layers | 4 |
| Copper area per layer | ≈800 mm² |
| Lead‑free | Yes |
The reference board is 40 × 40 mm (1600 mm²).
The board uses four copper layers.
Yes, the device is specified as lead‑free.