The Glenair F-313 Combo Solder Cup Micro‑D datasheet provides specifications, dimensions, materials, and ordering information for high‑power Micro‑D connectors.
The F-313 Combo Solder Cup Micro‑D connector combines the compact size of a Micro‑D interface with the ability to handle higher power levels. It features gold‑plated beryllium‑copper power contacts for up to #16 AWG stranded wire and signal contacts for up to #26 AWG wire, complying with MIL‑DTL‑83513 for high‑temperature, shock, and vibration resistance.
The datasheet lists performance specifications such as a 3 A signal contact rating, 13 A power contact rating, 600 VAC dielectric withstanding voltage, and an operating temperature range of –55 °C to +150 °C. Materials include an aluminum alloy 6061 shell, liquid crystal polymer insulator, and gold‑over‑nickel plated contacts. Various shell finishes and mounting hardware options are also detailed.
| Signal Contact Current Rating | 3 A |
|---|---|
| Dielectric Withstanding Voltage | 600 VAC |
| Insulation Resistance | 5000 Megohms |
| Minimum Contact Resistance | 8 mΩ |
| Maximum Low Level Contact Resistance | 32 mΩ |
| Operating Temperature Range | -55 °C to +150 °C |
| Shell Material | Aluminum Alloy 6061 |
| Insulator Material | Liquid Crystal Polymer (LCP) |
| Contact Plating | Gold over Nickel |
The signal contacts are rated for 3 A.
Available finishes include Cadmium, Nickel, Black Anodize, Gold, and Chem Film.
The connector can withstand up to 600 VAC.