Fairchild MicroFET 3x2 Power MOSFET Recommended Land Pattern and Thermal Performance

About this manual

This document provides an application note for the Fairchild MicroFET™ 3x2 single-channel Power MOSFET, which features an exposed drain pad for improved surface-mount thermal characteristics. It discusses pin-outs, land pattern dimensions, and thermal performance analysis.

What's inside

• Introduction
• Pin-out
• Single Package Dimensions
• Thermal Performance Junction-to-Case
• Recommended land pattern
• Junction-to-Ambient Thermal Resistance

Frequently asked questions

What is the typical junction-to-case thermal resistance for the MicroFET 3x2?

The typical junction-to-case thermal resistance is 4.5 oC/W.

What is the maximum power dissipation for the MicroFET 3x2 with a 1in2 copper area at 150oC?

The maximum power dissipation is 2.23W.