1PS10SB62 is a Schottky barrier diode produced by Philips Semiconductors. It features ultra-high switching speed, very low capacitance, high breakdown voltage, leadless ultra-small plastic package (1 mm x 0.6 mm x 0.5 mm), boardspace 1.17 mm2 (approx. 10% of SOT23), power dissipation comparable to SOT23.
The document is a product specification for the Philips 1PS10SB62, an epitaxial Schottky barrier diode encapsulated in a SOD882 leadless ultra small plastic package. Key features include ultra-high switching speed, very low capacitance, and a high breakdown voltage of 40 V. The device is designed for applications requiring ultra-high-speed switching and high-frequency performance, such as mobile communication, digital cameras, PDAs, and PCMCIA cards.
The datasheet details limiting values, electrical characteristics, and thermal characteristics. It specifies a maximum continuous reverse voltage of 40 V and a maximum continuous forward current of 20 mA. The package dimensions are 1 mm x 0.6 mm x 0.5 mm, offering significant boardspace savings compared to SOT23 packages.
| Continuous reverse voltage | 40 V |
|---|---|
| Continuous forward current | 20 mA |
| Storage temperature | -65 +150 °C |
| Junction temperature | 150 °C |
| Forward voltage | 800 mV |
| Reverse current | 1 nA |
| Diode capacitance | 0.6 pF |
| Thermal resistance (junction to ambient) | 500 K/W |
It is encapsulated in a SOD882 leadless ultra small plastic package.
It is used for ultra-high-speed switching and high-frequency applications in mobile communication, digital cameras, PDAs, and PCMCIA cards.
Reflow soldering is the only recommended soldering method.