This is a design reference manual for HTSSOP-B40 package, including information such as product size, pin layout, pad size, etc.
The document presents the HTSSOP‑B40 semiconductor package, noting that images are not scaled and that a 3D‑enabled browser is required to view the content. It also lists recommended conditions such as compatibility with Adobe Reader 8.0 or later.
Legal and safety information is included, stating that copying is prohibited without ROHM's consent, the package is not radiation‑tolerant, and it is intended for general‑use electronic equipment but not for safety‑critical applications.
| Package type | HTSSOP-B40 |
|---|
No, the products specified in this document are not designed to be radiation tolerant.
No, copying or reproduction of the document is not permitted without ROHM's consent.