HTSSOP-A44R package dimension
This design support document describes the HTSSOP-A semiconductor package, covering its structure, materials, and recommended handling. It includes detailed information on tape‑and‑reel packaging, storage conditions, marking, footprint dimensions, and soldering procedures.
Key sections cover the package construction (lead frame, die, die‑attach, wire, molding), tape and reel specifications, recommended storage temperature and humidity, solder reflow and wave soldering profiles, and packing and shipping guidelines. The document also lists typical dimensions for the HTSSOP‑A44 and HTSSOP‑A44R variants.
| Lead Frame Material | Cu‑Alloy (Pb free solder plating) |
|---|---|
| Die Material | Silicon |
| Die Attach | Ag paste |
| Wire Material | Cu |
| Molding Material | Epoxy Resin |
| Recommended Storage Temperature | 5 to 30 °C |
| Recommended Storage Humidity | 40 to 70 % RH |
| Specified Storage Period | 1 year |
| Maximum Reflow Temperature | 260 °C |
| Preheating Temperature Range (Reflow) | 130 °C to 190 °C |
| Wave Soldering Preheat Temperature | 120 °C to 150 °C |
| Solder Iron Temperature Limit | ≤ 380 °C |
| HTSSOP‑A44 Package Dimensions (mm) | 0.80 × 7.70 × 1.20 × 0.50 |
Store the packages at 5 °C to 30 °C with 40 % to 70 % relative humidity.
Assemble the package within 168 hours after the dry pack is opened.
The reflow temperature should not exceed 260 °C.
The HTSSOP‑A44 package measures 0.80 mm (land pitch) × 7.70 mm (land space) × 1.20 mm (land length) × 0.50 mm (land width).