HTSSOP-B is a type of electronic component package from ROHM. This document provides design information for this package form, such as dimensions.
This document describes the HTSSOP‑B family of semiconductor packages offered by ROHM. It covers the physical structure, material composition, and detailed mechanical dimensions for each variant (B20, B24, B28, B30, B40).
Key sections include tape‑and‑reel packaging information, storage environment recommendations, marking and lot‑number conventions, footprint dimensions, and recommended soldering profiles for reflow, wave, and hand soldering processes.
| Recommended storage temperature | 5 °C to 30 °C |
|---|---|
| Recommended storage humidity | 40 % to 70 % RH |
| Specified storage period | 1 year |
| Reflow peak temperature | 220 °C to 230 °C |
| Maximum reflow preheat temperature | 260 °C max |
| Solder‑iron temperature limit | ≤ 380 °C |
| Cover‑tape peelback strength | 0.2 N to 0.7 N |
| Units per reel (HTSSOP‑B20) | 2 500 pcs |
The document specifies a storage temperature range of 5 °C to 30 °C and a humidity range of 40 % to 70 % RH.
A standard reel can hold 2 500 HTSSOP‑B20 devices.
The cover tape should have a peelback strength between 0.2 N and 0.7 N.