This document is about the ROHM HSOP-M package, including package dimensions, pin definition and other information
The Design Support Document for the ROHM HSOP-M package supplies detailed information on the package structure, materials, and mechanical dimensions. It includes tape‑and‑reel packaging data, labeling, and shipping instructions.
Key sections cover storage conditions, marking lot numbers, footprint dimensions, and recommended soldering profiles for both reflow and wave soldering. The document also lists recommended solder‑iron settings and peel‑back specifications for reliable assembly.
| Package model | HSOP-M |
|---|---|
| Storage temperature range | 5 to 30°C |
| Storage humidity range | 40 to 70% RH |
| Reflow preheat temperature | 130°C to 190°C |
| Reflow soldering temperature | 220°C to 230°C |
| Wave soldering preheat temperature | 120°C to 150°C |
| Solder iron temperature limit | ≤ 380°C |
| Footprint pitch (HSOP-M28) | 0.80 mm |
Store the HSOP-M package at temperatures between 5 °C and 30 °C with relative humidity of 40 % to 70 %.
Use a preheating temperature of 130 °C to 190 °C, followed by a soldering temperature of 220 °C to 230 °C.
Preheat the board to 120 °C‑150 °C for up to 60 seconds, then solder at 260 °C (±3 °C) for up to 12 seconds.